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Features:
Single-Band 100W High-Power FDD Amplifier – Dedicated to B7 (2620–2690MHz downlink / 2500–2570MHz uplink) with 50±1dBm output, purpose-built for high-capacity 4G/LTE coverage extension and macro-cell gap filling.
GaN Efficiency for 100W Class Operation – Powered by 48V with ≤7.5A current draw, achieving exceptional power-added efficiency that minimizes heat generation and enables passive cooling in compact outdoor enclosures.
Ultra-Low Uplink Noise Figure for Enhanced Sensitivity – Achieves ≤2dB noise figure on the uplink path, significantly improving base station receiver sensitivity and extending effective talk-back range in weak-signal environments.
High Linearity for Dense Modulation – Maintains ≤5% EVM at 10.0dB peak-to-average ratio, ensuring clean amplification of 64QAM and carrier-aggregated signals without spectral regrowth.
Extended Thermal Headroom for Continuous High-Power Operation – Hardware-based over-temperature shutdown at 95°C with auto-recovery at 75°C provides 10°C higher margin than standard designs, sustaining 100W output in elevated ambient temperatures.
RS485 Full-Duplex Telemetry – 19200 baud interface enables remote gain/ATT adjustment, real-time queries of forward power (accuracy ±1dB over >20dB dynamic range) and internal temperature (accuracy ±3℃), plus module on/off control.
Comprehensive Fault Protection Suite – Dual-layer defense: over-power alarm triggers at +2dB above rated maximum; over-temperature alarm notifies host before shutdown; both active fault reports enable remote diagnostics without site visits.
Precision Downlink Conditioning – Integrated ATT provides ≥25dB gain adjustment range with ≤±1.5dB flatness across all attenuation steps; ALC extends ≥10dB dynamic range to stabilize output against input variations.
CMOS 3.3V FDD Path Control – Independent logic inputs for TX/PA and RX/LNA switching (high=enable, low=disable), simplifying external T/R switch control in FDD repeater and distributed antenna system designs.
Compact 180×110×23mm Form Factor – Space-efficient enclosure with MCX (PA IN) and SMA (PA OUT, LNA IN, LNA OUT) connectors, enabling dense integration into 19″ rack-mount repeaters and pole-mounted RRU housings.
Technical Specification:
Product Name:
1. UZI-FDD-B7-2.6G-100W-180110-48VGaN
Items: | Uplink (UL) & Downlink (UL) Specifications: |
Frequency Range: | 1. a. UL:2500_2570 MHz b. DL:2620_2690 MHz |
Max Gain: | 1. UL:25±2dB 2. DL:53±2dB |
Maximum Output Power: | 1. UL:Uncontrolled 2. DL:50±1 dBm |
Maximum Input Level: | 1. NONE 2. DL:+10dBm |
Gain Adjustment Range: | 1. UL:NONE 2. DL:≥25dB |
ALC Range: | 1. UL:NONE 2. DL:≥10dB |
Gain Flatness: | 1. UL:NONE 2. DL a. ATT10dB： ≤±1dB b. ATT20dB： ≤±1dB c. ATT25dB： ≤±1.5dB |
In-Band Ripple: | ≤2.5dB |
Noise Figure: | 1. UL:≤2dB 2. DL:NONE |
EVM: | ≤5% (Peak-to-Average Power Ratio 10.0dB) |
VSWR: | ≤1.4 (Test condition: power on for testing after turning off the downlink power amplifier.) |
Operating Voltage: | 48V |
Operating Current: | ≤7.5A |
Baud Rate: | 19200 |
Working Temperature: | -40~+55℃ |
Over-Temperature Protection: | Alarm and shutdown at +95℃, resume operation at 75℃ |
Connecter: | 4 connectors in total: MCX for PA IN, SMA for all others |
Amplifier Dimensions: | 180*110*23 |
Monitoring Functions: | 1. For the wiring diagram of the monitoring port, refer to the outline dimension drawing; RS485 interface communication • Setting: switch, gain; • Query: module status (including power amplifier status, over-power alarm, over-temperature alarm), power amplifier temperature, power amplifier ATT value, detected forward power; • Over-power alarm: alarm triggered when power exceeds maximum output power by +2dB; |
• Over-temperature alarm: recommended threshold is +85℃; alarm triggered when detected temperature exceeds +85℃, with the power amplifier turned off simultaneously and turned on again at +65℃; • Power amplifier temperature detection: detection range shall include but not be limited to -25℃~+85℃, with a detection accuracy of ±3℃; • Forward power detection: detection range shall be greater than 20dB, with a detection accuracy of less than ±1dB; |
Dimensional Drawing:
1. RX:LNA (uplink) switch, CMOS 3.3V high level turns it on, low level turns it off.
2.TX:PA (downlink) switch, CMOS 3.3V high level turns it on, low level turns it off.
Sample:
