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Features:
Specialized 1300–1500 MHz TDD coverage – Optimized for communication scenarios requiring mid-band spectrum, including tactical and private network deployments.
150W high-power downlink output – Delivers 52±1dBm to overcome path loss in large-area coverage or through dense obstacles.
Ad-hoc network centric design – Enables decentralized, infrastructure-free deployments for rapid field deployment and mesh networking.
Pre-distortion-free architecture – Omits digital pre-distortion to minimize circuit complexity while still meeting EVM ≤5% at 10dB PAPR for ad-hoc applications.
Extended thermal operating window – Certified from -25°C to +60°C, with functional operation from -40°C to +55°C, handling extreme seasonal and geographic conditions.
Hardwired over-temperature cutoff – Fixed +95°C thermal shutdown with automatic restart at 65°C; no software or external controller required.
Uplink path with integrated band filtering – Reduces out-band interference and uplink noise floor, improving signal-to-noise ratio for received signals.
Dual-purpose 2JT RF connector – Combines PA IN and LNA OUT into a single MCX port, while ANT uses an N-type connector; CMOS 3.3V logic controls the TX path only.
Technical Specification:
Product Name:
1. UZI-TDD-1.3~1.5G-10W-105-28V
Items: | Uplink (UL) & Downlink (UL) Specifications: |
Frequency Range: | 1. UL:1300-1500MHz 2. DL:1300-1500MHz |
Max Gain: | 1. UL:10±2dB 2. DL:45±2dB |
Maximum Output Power: | 1. UL:Uncontrolled 2. DL:40±1dBm |
Maximum Input Level: | 1. UL:NONE 2. DL:-2dBm |
Gain Adjustment Range: | NONE |
ALC Range: | NONE |
In-Band Ripple: | ≤2.5dB |
Noise Figure: | 1. UL:≤3dB 2. DL:NONE |
Tx-Rx Isolation: | ≥55dBc |
EVM: | ≤3.5% (Peak-to-Average Power Ratio 8.0dB) |
VSWR: | 1. UL: ≤1.4 2. DL:NONE |
Operating Voltage: | 28V |
Operating Current: | ≤1.8A |
Working Temperature: | -40~+55℃ |
Over-Temperature Protection: | Alarm and shutdown at +85℃, resume operation at 65℃ |
Monitoring Functions: | NONE |
Transmit - receive wire control interface: | CMOS3.3V |
Connecters: | There are 3 connectors in total: PA IN: MCX connector; The remaining ones: SMA connectors |
Mechanical Dimensions: | 100*50*18 |
Dimensional Drawing:
1.RX:LNA (uplink) switch, CMOS 3.3V high level turns it on, low level turns it off.
2.TX:PA (downlink) switch, CMOS 3.3V high level turns it on, low level turns it off.
Sample:
